LOCTITE3128? is a one part, heat curable epoxy. This
product is designed to cure at low temperature and gives
excellent adhesion on a wide range of materials in
considerably short time. Typical applications include Memory
cards, CCD/CMOS Assemblies. Particularly suited where low
curing temperatures are required for heat sensitive
components.LOCTITE 3220 is designed for use in heat sensitive devices.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Casson Viscosity @ 25 °C, mPa?s (cP):
Haake PK 100, M10/PK 1 2° Cone
Yield Point @ 25°C, MPa
Specific Gravity
Pot Life @ 25oC, days
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