美國UDM AKLC300系列濃縮晶圓切削液
? AKLC300洗滌劑濃縮液是一種可生物降解、水性、非堿性、非酸性物質
? PV wafer Cleaning after wafering
用于切片之后對光伏硅片進行清洗
? DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1
去離子水/反滲透水:洗滌劑溶液比例 – 1000:1至500:1
? Application temperature: 45°C - 70°C
使用溫度:45°C - 70°C
? Excellent wetting, cleaning and rinsing properties
極好的濕潤、清潔和沖洗功能
? Water surface tension reducer
降低去離子水/反滲透水表面張力
? Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces
可以徹底清潔硅片表面的碳化硅(SiC)塵埃以及其他臟污
? Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
在切片以及去膠工序之后徹底清除光伏硅片表面的銅和鐵
? Biodegradable, non-hazardous and hence easily disposable
可生物降解、無危害,可以很容易進行處置
? Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)
? Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)
化學需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)
聯系人:陳先生
手機:13602588976